公开(公告)号：US11758650B2

公开(公告)日：2023-09-12

申请号：US17246271

申请日：2021-04-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Jung Byun ,  Jung Soo Kim ,  Sang Hyun Sim ,  Chang Min Ha ,  Jin Won Lee

IPC: H05K1/18 ,  H05K1/02 ,  G06F1/16

CPC classification number: H05K1/0281 ,  G06F1/1652 ,  H05K1/189 ,  H05K2201/10128

Abstract: A flexible printed circuit board includes a base film; a circuit pattern disposed on one surface of the base film; and a coverlay film covering the circuit pattern. The base film is divided into a flexible area and a rigid area, and the circuit pattern of the flexible area comprises a portion thinner than a portion of the circuit pattern of the rigid area.

公开(公告)号：US11576254B2

公开(公告)日：2023-02-07

申请号：US17199131

申请日：2021-03-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jung Soo Kim ,  Dae Jung Byun ,  Sang Hyun Sim ,  Chang Min Ha

IPC: H05K1/02

Abstract: A cable substrate includes an insulating layer, a slit portion penetrating through at least a portion of the insulating layer in a thickness direction of the insulating layer, and a dummy pattern disposed on the insulating layer. At least a portion of the dummy pattern is exposed to the slit portion.

公开(公告)号：US20220167496A1

公开(公告)日：2022-05-26

申请号：US17246271

申请日：2021-04-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Jung Byun ,  Jung Soo Kim ,  Sang Hyun Sim ,  Chang Min Ha ,  Jin Won Lee

IPC: H05K1/02 ,  G06F1/16 ,  H05K1/18

Abstract: A flexible printed circuit board includes a base film; a circuit pattern disposed on one surface of the base film; and a coverlay film covering the circuit pattern. The base film is divided into a flexible area and a rigid area, and the circuit pattern of the flexible area comprises a portion thinner than a portion of the circuit pattern of the rigid area.

公开(公告)号：US12219692B2

公开(公告)日：2025-02-04

申请号：US18517393

申请日：2023-11-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Jung Byun ,  Jung Soo Kim ,  Sang Hyun Sim ,  Chang Min Ha ,  Tae Hong Min ,  Jin Won Lee

IPC: H05K1/02

Abstract: A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.

公开(公告)号：US11864307B2

公开(公告)日：2024-01-02

申请号：US17124893

申请日：2020-12-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Jung Byun ,  Jung Soo Kim ,  Sang Hyun Sim ,  Chang Min Ha ,  Tae Hong Min ,  Jin Won Lee

IPC: H05K1/02

CPC classification number: H05K1/0218 ,  H05K1/024 ,  H05K1/0256 ,  H05K1/0298 ,  H05K2201/0141

Abstract: A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.