Invention Grant
- Patent Title: Power semiconductor cooling module for electric vehicle
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Application No.: US17433057Application Date: 2020-02-20
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Publication No.: US11758698B2Publication Date: 2023-09-12
- Inventor: Hwan Ku Lee
- Applicant: AMOGREENTECH CO., LTD.
- Applicant Address: KR Gimpo-si
- Assignee: AMOGREENTECH CO., LTD.
- Current Assignee: AMOGREENTECH CO., LTD.
- Current Assignee Address: KR Gimpo-si
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: KR 20190021786 2019.02.25 KR 20200020269 2020.02.19
- International Application: PCT/KR2020/002445 2020.02.20
- International Announcement: WO2020/175848A 2020.09.03
- Date entered country: 2021-08-23
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K5/02

Abstract:
Provided is a power semiconductor cooling module for an electric vehicle. The power semiconductor cooling module for an electric vehicle, according to one exemplary embodiment of the present invention, is electrically connected to a motor and comprises: a box-shaped housing part having an inner space; a power element part disposed in the inner space and electrically connected to a motor via at least one busbar; a heat dissipation part disposed in the inner space so as to make contact with the power element part in order to cool heat generated from the power element part; and a heat backflow prevention member disposed so as to surround at least a portion of the total length of the busbar, and disposed so as to make contact with the heat dissipation part.
Public/Granted literature
- US20220167525A1 POWER SEMICONDUCTOR COOLING MODULE FOR ELECTRIC VEHICLE Public/Granted day:2022-05-26
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