Invention Grant
- Patent Title: Semiconductor module including piezoelectric layer and method for manufacturing the same
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Application No.: US17022150Application Date: 2020-09-16
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Publication No.: US11758815B2Publication Date: 2023-09-12
- Inventor: Zhi-Biao Zhou
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsinchu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C
- Priority: CN 2010781779.0 2020.08.06
- Main IPC: H10N30/05
- IPC: H10N30/05 ; H10N30/072 ; H10N30/80
Abstract:
A semiconductor module and a method for manufacturing the same are provided. The semiconductor module includes a substrate comprising a front side and at least one semiconductor device formed on the front side, a shielding structure formed on the at least one semiconductor device, and a piezoelectric layer formed on the shielding structure.
Information query
