Invention Grant
- Patent Title: MEMS stress reduction structure embedded into package
-
Application No.: US17343919Application Date: 2021-06-10
-
Publication No.: US11760627B2Publication Date: 2023-09-19
- Inventor: Roberto Brioschi , Benyamin Gholami Bazehhour , Milena Vujosevic , Kazunori Hayata
- Applicant: InvenSense, Inc.
- Applicant Address: US CA San Jose
- Assignee: InvenSense, Inc.
- Current Assignee: InvenSense, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Van Hoven PC
- Agent Joshua Van Hoven
- Main IPC: B81B7/00
- IPC: B81B7/00 ; B81C1/00
Abstract:
A microelectromechanical system (MEMS) sensor package includes a laminate that provides physical support and electrical connection to a MEMS sensor. A resin layer is embedded within an opening of the laminate and a MEMS support layer is embedded within the opening by the resin layer. A MEMS structure of the MEMS sensor is located on the upper surface of the MEMS support layer.
Public/Granted literature
- US20220396472A1 MEMS STRESS REDUCTION STRUCTURE EMBEDDED INTO PACKAGE Public/Granted day:2022-12-15
Information query
