- Patent Title: Copper oxide ink and method for producing conductive substrate using same, product containing coating film and method for producing product using same, method for producing product with conductive pattern, and product with conductive pattern
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Application No.: US16633396Application Date: 2018-07-27
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Publication No.: US11760895B2Publication Date: 2023-09-19
- Inventor: Masanori Tsuruta , Toru Yumoto
- Applicant: Asahi Kasei Kabushiki Kaisha
- Applicant Address: JP Tokyo
- Assignee: Asahi Kasei Kabushiki Kaisha
- Current Assignee: Asahi Kasei Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Morgan, Lewis & Bockius LLP
- Priority: JP 17145187 2017.07.27 JP 17145188 2017.07.27 JP 18023239 2018.02.13
- International Application: PCT/JP2018/028238 2018.07.27
- International Announcement: WO2019/022230A 2019.01.31
- Date entered country: 2020-01-23
- Main IPC: C09D11/52
- IPC: C09D11/52 ; B05D3/06 ; B05D3/14 ; C09D11/033 ; C09D11/037 ; H01Q1/38

Abstract:
In the present invention, a conductive film having low resistance is formed on a substrate, said film having excellent storage stability and high dispersion stability as an ink. A copper oxide ink (1) contains a copper oxide (2), a dispersant (3), and a reducing agent. The content of the reducing agent is in the range of formula (1), and the content of the dispersant is in the range of formula (2). (1) 0.00010≤(reducing agent mass/copper oxide mass)≤0.10 (2) 0.0050≤(dispersant mass/copper oxide mass)≤0.30 The reducing agent content promotes the reduction of copper oxide to copper during firing, and promotes the sintering of copper.
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