Invention Grant
- Patent Title: Integrated magnetic assemblies and methods of assembling same
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Application No.: US16000492Application Date: 2018-06-05
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Publication No.: US11763976B2Publication Date: 2023-09-19
- Inventor: Ke Dai , Lanlan Yin , Tom Sun
- Applicant: ABB Power Electronics Inc.
- Applicant Address: US TX Plano
- Assignee: ABB Power Electronics Inc.
- Current Assignee: ABB Power Electronics Inc.
- Current Assignee Address: US TX Plano
- Agency: Armstrong Teasdale LLP
- Priority: CN 1710651662.9 2017.08.02
- Main IPC: H01F17/04
- IPC: H01F17/04 ; H01F27/245 ; H01F27/26 ; H01F27/30 ; H01F27/38 ; H01F3/14 ; H01F27/28 ; H01F27/29 ; H01F41/02 ; H01F41/04

Abstract:
An integrated magnetic core is provided. The integrated magnetic core includes a first plate and a second plate. The first plate includes a plurality of legs extending outwardly from a first surface of the first plate. The plurality of legs includes first and second oppositely disposed legs and third and fourth oppositely disposed legs. The second plate is coupled to at least the third and fourth legs of the first plate.
Public/Granted literature
- US20190043653A1 INTEGRATED MAGNETIC ASSEMBLIES AND METHODS OF ASSEMBLING SAME Public/Granted day:2019-02-07
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