Invention Grant
- Patent Title: Coil component
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Application No.: US16531637Application Date: 2019-08-05
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Publication No.: US11763978B2Publication Date: 2023-09-19
- Inventor: Ju Hwan Yang , Tae Jun Choi , Byung Soo Kang , Woo Chui Shin , Byeong Cheol Moon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20190030355 2019.03.18
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/06 ; H01F27/29

Abstract:
A coil component may include a body having one surface and the other surface facing each other; a wound coil embedded in the body; a first lead frame and a second lead frame, embedded in the body and each having one surface exposed to the one surface of the body to be spaced apart from each other; and a connection portion connecting at least one of the first and second lead frames and at least one end portion of the wound coil.
Public/Granted literature
- US20200303113A1 COIL COMPONENT Public/Granted day:2020-09-24
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