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    MULTILAYER CERAMIC CAPACITOR
    1.
    发明申请
    MULTILAYER CERAMIC CAPACITOR 审中-公开

    公开(公告)号：US20200082984A1

    公开(公告)日：2020-03-12

    申请号：US16197734

    申请日：2018-11-21

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Byung Gyun KIM ,  Ji Hong JO ,  Jong Ho LEE ,  Myung Jun PARK

    IPC分类号： H01G4/232 ,  H01G4/30 ,  H01G4/248 ,  H01G4/012

    摘要： A multilayer ceramic capacitor includes a body including a dielectric layer and an internal electrode and an external electrode disposed on an exterior of the body. The external electrode includes an electrode layer connected to the internal electrode and a plating portion including a nickel (Ni) plating layer, a nickel-tin (Ni—Sn) intermetallic compound layer, and a tin (Sn) plating layer, sequentially disposed on the electrode layer. The Ni-Sn intermetallic compound layer has a thickness of 0.1 μm or more.

    SEMICONDUCTOR PACKAGE
    2.
    发明申请
    SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：US20190244885A1

    公开(公告)日：2019-08-08

    申请号：US16105289

    申请日：2018-08-20

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Eun Jin KIM ,  Han KIM

    IPC分类号： H01L23/498 ,  H01L23/31 ,  H01L23/043

    摘要： A semiconductor package includes a connection member having a first surface and a second surface disposed to oppose each other and including an insulating member having a plurality of insulating layers and a plurality of redistribution layers disposed on the plurality of insulating layers, respectively; a semiconductor chip disposed on the first surface of the connection member and having connection pads electrically connected to the plurality of redistribution layers; and an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip, wherein at least one of the plurality of redistribution layers includes a dummy electrode pattern in which a plurality of holes are arranged, and each of the plurality of holes has a shape including a plurality of protruding regions that protrude externally from different positions.

    MULTILAYER CERAMIC ELECTRONIC COMPONENT ARRAY
    3.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT ARRAY 审中-公开

    公开(公告)号：US20200118763A1

    公开(公告)日：2020-04-16

    申请号：US16201607

    申请日：2018-11-27

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Ki Young KIM ,  Beom Joon CHO ,  Sang Soo PARK ,  Woo Chul SHIN

    IPC分类号： H01G4/38 ,  H01G4/232 ,  H01G4/248

    摘要： A multilayer ceramic electronic component array includes: a plurality of multilayer ceramic electronic components; a first terminal structure electrically connected to first external electrodes of each of the plurality of multilayer ceramic electronic components; a second terminal structure electrically connected to second external electrodes of each of the plurality of multilayer ceramic electronic components; a first conductive bonding member bonding the first external electrodes of each of the plurality of multilayer ceramic electronic components and the first terminal structure; a second conductive bonding member bonding the second external electrodes of each of the plurality of multilayer ceramic electronic components and the second terminal structure; and a ceramic bonding member contacting first surfaces of each of the ceramic bodies of each of the plurality of multilayer ceramic electronic components and disposed to extend to second surfaces of each of the ceramic bodies.

    MULTILAYER CAPACITOR AND BOARD HAVING THE SAME
    4.
    发明申请
    MULTILAYER CAPACITOR AND BOARD HAVING THE SAME 审中-公开

    公开(公告)号：US20190074137A1

    公开(公告)日：2019-03-07

    申请号：US16004830

    申请日：2018-06-11

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Jong Pil LEE ,  Hyo Youn LEE ,  Sung Kwon AN ,  Seung Woo SONG ,  Taek Jung LEE ,  Jin Kyung JOO

    IPC分类号： H01G4/232 ,  H01G4/30 ,  H01G4/012 ,  H01G4/248 ,  H05K1/18

    摘要： A multilayer capacitor and a board having the same provide high capacitance and low equivalent series inductance (ESL). The multilayer capacitor includes a capacitor body including an active region, including first and second internal electrodes, and first and second cover regions. Third and fourth internal electrodes are alternately disposed in the cover region adjacent to amounting surface. First and second external electrodes respectively contact the first and second internal electrodes to provide capacitance. First and second via electrodes are disposed in the cover region, where the first via electrode connects the third internal electrode and a first band portion of the first external electrode to each other, and where the second via electrode connects the fourth internal electrode and a second band portion of the second external electrode to each other.

    Manufacturing method of multilayer ceramic electronic component
    9.
    发明授权
    Manufacturing method of multilayer ceramic electronic component 有权

    公开(公告)号：US11636983B2

    公开(公告)日：2023-04-25

    申请号：US17726888

    申请日：2022-04-22

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Tae Sung Kim ,  Hyeong Sik Yun ,  Woo Chul Shin ,  Joon Woon Lee

    IPC分类号： H01G4/30 ,  H01G4/012 ,  H01G4/12

    摘要： The multilayer ceramic electronic component includes a ceramic body including a dielectric layer; and first and second internal electrodes disposed inside the ceramic body, and disposed to oppose each other with the dielectric layer interposed therebetween. When an average thickness of the dielectric layer is referred to as td and a standard deviation of a thickness of the dielectric layer in each position is referred to as σtd, while an average thickness of the first and second internal electrodes is referred to as to and a standard deviation of a thickness of a pre-determined region of any layer of the internal electrodes in each position is referred to as σte, a ratio (σte/σtd) of the standard deviation of the internal electrodes in each position to the standard deviation of the thickness of the dielectric layer in each position satisfies 1.10≤σte/σtd≤1.35.