Invention Grant
- Patent Title: Three-color 3D DRAM stack and methods of making
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Application No.: US17487596Application Date: 2021-09-28
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Publication No.: US11764058B2Publication Date: 2023-09-19
- Inventor: Arvind Kumar , Mahendra Pakala , Ellie Y. Yieh , John Tolle , Thomas Kirschenheiter , Anchuan Wang , Zihui Li
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L29/06 ; H01L29/786 ; H01L29/66 ; H01L21/306 ; H10B12/00
Abstract:
Methods of reducing wafer bowing in 3D DRAM devices are described using a 3-color process. A plurality of film stacks are formed on a substrate surface, each of the film stacks comprises two doped SiGe layers having different dopant amounts and/or Si:Ge ratios and a doped silicon layer. 3D DRAM devices are also described.
Public/Granted literature
- US20230102558A1 THREE-COLOR 3D DRAM STACK AND METHODS OF MAKING Public/Granted day:2023-03-30
Information query
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