- 专利标题： Chip package structure with anchor structure and method for forming the same
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申请号： US17313229申请日： 2021-05-06
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公开(公告)号： US11764168B2公开(公告)日： 2023-09-19
- 发明人: Hui-Ting Lin , Chin-Fu Kao , Chen-Shien Chen
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW Hsinchu
- 代理机构： McClure, Qualey & Rodack, LLP
- 主分类号： H01L21/50
- IPC分类号： H01L21/50 ; H01L23/32 ; H01L23/00
摘要：
A chip package structure is provided. The chip package structure includes a wiring substrate having a surface. The chip package structure includes a chip structure over the surface of the wiring substrate. The chip package structure includes an antiwarpage structure over the surface of the wiring substrate. The antiwarpage structure surrounds the chip structure. The chip package structure includes a first anchor structure affixed to the surface of the wiring substrate and adjacent to a first lower portion of the antiwarpage structure. The first lower portion is between the first anchor structure and the chip structure, and the first anchor structure is electrically isolated from the chip structure.
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