Invention Grant
- Patent Title: Laser system and method for manufacturing electronic device
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Application No.: US17220270Application Date: 2021-04-01
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Publication No.: US11764541B2Publication Date: 2023-09-19
- Inventor: Taisuke Miura , Osamu Wakabayashi , Hironori Igarashi
- Applicant: Gigaphoton Inc.
- Applicant Address: JP Tochigi
- Assignee: Gigaphoton Inc.
- Current Assignee: Gigaphoton Inc.
- Current Assignee Address: JP Tochigi
- Agency: Studebaker & Brackett PC
- Main IPC: H01S3/23
- IPC: H01S3/23 ; H01S5/00 ; H01S5/042 ; H01S5/068 ; H01S5/50 ; H01S5/0687 ; G03F7/00 ; H01S5/12

Abstract:
In a laser system according to a viewpoint of the present disclosure, a first amplifier amplifies first pulsed laser light outputted from a first semiconductor laser system into second pulsed laser light, a wavelength conversion system converts the second pulsed laser light in terms of wavelength into third pulsed laser light, and an excimer amplifier amplifies the third pulsed laser light. The first semiconductor laser system includes a first current controller that controls current flowing through a first semiconductor laser in such a way that first laser light outputted from the first semiconductor laser is caused to undergo chirping and a first semiconductor optical amplifier that amplifies the first laser light into pulsed light. The laser system includes a control section that controls the amount of chirping performed on the first pulsed laser light in such a way that excimer laser light having a target spectral linewidth is achieved.
Public/Granted literature
- US20210226414A1 LASER SYSTEM AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE Public/Granted day:2021-07-22
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