- 专利标题: Semiconductor memory device and method of forming the same
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申请号: US17398806申请日: 2021-08-10
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公开(公告)号: US11765890B2公开(公告)日: 2023-09-19
- 发明人: Keisuke Shimada
- 申请人: MICRON TECHNOLOGY, INC.
- 申请人地址: US ID Boise
- 专利权人: Micron Technology, Inc.
- 当前专利权人: Micron Technology, Inc.
- 当前专利权人地址: US ID Boise
- 代理机构: Dorsey & Whitney LLP
- 主分类号: H10B12/00
- IPC分类号: H10B12/00 ; H01L21/768 ; G11C11/402 ; G11C5/06
摘要:
A method includes forming a plurality of first line-shaped mask patterns over a substrate including a memory cell region and an array edge region; forming a plurality of second line-shaped mask patterns over the plurality of first line-shaped mask patterns; removing first portions from the plurality of first line-shaped mask patterns in the memory cell region to leave a plurality of island-shaped mask patterns above the memory cell region; removing second portions from the plurality of first line-shaped mask patterns in the array edge region to leave a holes-provided mask pattern above the array edge region; forming a mask pattern which includes a plurality of holes provided on portions; and forming, with the mask pattern which includes the plurality of holes, a plurality of contact holes in the array edge region to provide a plurality of contact electrodes connected to a plurality of word-lines.
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