An electronic circuit board includes a printed circuit board and first and second electronic components. The printed circuit board includes a first insulating layer, a second insulating layer attached to the first insulating layer and in which is formed an open cavity, and a second conductive layer attached to the second insulating layer. The second conductive layer is treated to form a surface solder pad. The first electronic component is housed in the open cavity of the second insulating layer. The second electronic component is placed on the second insulating layer without overlapping with the open cavity. The first electronic component and the second electronic component each include a termination soldered on the surface solder pad, the surface solder pad being shared by the first and second electronic components.