Invention Grant
- Patent Title: Light-emitting module
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Application No.: US18048404Application Date: 2022-10-20
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Publication No.: US11777069B2Publication Date: 2023-10-03
- Inventor: So Sakamaki
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Global IP Counselors, LLP
- Priority: JP 20015089 2020.01.31 JP 21006953 2021.01.20
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/50

Abstract:
A light emitting module includes a board, light sources, first and second wirings, and an insulating member. Each of the light sources includes first and second electrodes exposed from an upper side. The first wiring includes first extending portions and first connecting portions. The second wiring includes second extending portions and second connecting portions. The insulating member covers the first wiring and the second extending portions of the second wiring while a portion of each of the second extending portions of the second wiring is exposed from the insulating member through a corresponding one of the openings. The second connecting portions of the second wiring are arranged on or above a part of the insulating member positioned on or above the first connecting portions of the first wiring. The second connecting portions of the second wiring are respectively connected to the second extending portions at the openings.
Public/Granted literature
- US20230066932A1 LIGHT-EMITTING MODULE Public/Granted day:2023-03-02
Information query
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