- Patent Title: Semiconductor device package and method of manufacturing the same
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Application No.: US17133369Application Date: 2020-12-23
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Publication No.: US11777191B2Publication Date: 2023-10-03
- Inventor: Cheng-Yu Ho , Sheng-Chi Hsieh , Chih-Pin Hung
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: FOLEY & LARDNER LLP
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01L23/66 ; H01Q1/52 ; H01Q25/00
Abstract:
The present disclosure relates to a wireless communication module. The wireless communication module includes a first antenna layer and a second antenna layer non-coplanar with the second antenna layer. An electromagnetic wave of the first antenna and the second antenna are configured to have far-field interference to each other.
Public/Granted literature
- US20220200130A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2022-06-23
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