Invention Grant
- Patent Title: High-frequency module
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Application No.: US17663585Application Date: 2022-05-16
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Publication No.: US11777553B2Publication Date: 2023-10-03
- Inventor: Satoshi Sakurai , Satoshi Arayashiki , Satoshi Tanaka , Kyoichi Hirayama , Tomohito Ito , Kenta Kurahashi
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP 17244351 2017.12.20 JP 18065691 2018.03.29 JP 18119249 2018.06.22
- Main IPC: H04B1/48
- IPC: H04B1/48 ; H04B1/00

Abstract:
A high-frequency module includes a transmission signal amplifier that outputs a transmission signal to an antenna terminal side; a reception signal amplifier that amplifies a reception signal supplied from an antenna terminal; a switch that selectively connects the antenna terminal to either an output of the transmission signal amplifier or an input of the reception signal amplifier; and a directional coupler that is provided on a transmission signal path and detects a signal level of the transmission signal. The transmission signal amplifier is controlled by a first control signal supplied from a first control circuit. The reception signal amplifier is controlled by a second control signal supplied from a second control circuit. The switch is controlled by a switch control signal supplied from the first control circuit. The directional coupler is controlled by a coupler control signal supplied from the first control circuit.
Public/Granted literature
- US20220271790A1 HIGH-FREQUENCY MODULE Public/Granted day:2022-08-25
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