Invention Grant
- Patent Title: Acknowledgment shaping for downlink data bursts
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Application No.: US17319995Application Date: 2021-05-13
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Publication No.: US11777655B2Publication Date: 2023-10-03
- Inventor: Sitaramanjaneyulu Kanamarlapudi , Alok Mitra , Darshan Ashar , Arnaud Meylan
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Patterson & Sheridan LLP
- Main IPC: H04L1/1607
- IPC: H04L1/1607 ; H04W72/0446

Abstract:
Certain aspects of the present disclosure provide a technique executed by a user equipment (UE) for obtaining a burst of transmission control protocol (TCP) packets conveying packet data convergence protocol (PDCP) protocol data units (PDUs) by an application protocol TCP layer of a communication protocol stack of the UE. The UE may then determine a first number of a first plurality of acknowledge (ACK) tokens to transmit in a first transmission time interval (TTI) based on an amount of data used to ACK the burst of TCP packets. The UE may then transmit the first plurality of ACK tokens in the first TTI and a single ACK token in a second TTI subsequent to the first TTI.
Public/Granted literature
- US20210409158A1 ACKNOWLEDGMENT SHAPING FOR DOWNLINK DATA BURSTS Public/Granted day:2021-12-30
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