Invention Grant
- Patent Title: Soft magnetic alloy and magnetic device
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Application No.: US15881227Application Date: 2018-01-26
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Publication No.: US11783974B2Publication Date: 2023-10-10
- Inventor: Akihiro Harada , Hiroyuki Matsumoto , Kenji Horino , Kazuhiro Yoshidome , Akito Hasegawa , Hajime Amano , Kensuke Ara , Seigo Tokoro
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP 17014774 2017.01.30
- Main IPC: H01F1/153
- IPC: H01F1/153 ; C22C33/00 ; C22C38/08 ; C22C38/00 ; C22C38/06 ; H01F1/147 ; C22C33/02 ; C22C38/10 ; C22C45/02 ; C22C38/18 ; C22C38/04 ; C22C38/14 ; C22C38/60 ; C22C38/12 ; C22C38/32 ; B22F1/07 ; H01F27/25 ; H01F41/02 ; B22F9/00 ; C22C45/00

Abstract:
A soft magnetic alloy comprising a main component having a compositional formula of ((Fe(1−(α+β))X1αX2β)(1−(a+b+c))MaBbCrc)1−dCd, and a sub component including P, S and Ti, wherein X1 is selected from the group Co and Ni, X2 is selected from the group Al, Mn, Ag, Zn, Sn, As, Sb, Bi and rare earth elements, “M” is selected from the group Nb, Hf, Zr, Ta, Mo, W and V, 0.030≤a≤0.14, 0.005≤b≤0.20, 0
Public/Granted literature
- US20180218813A1 SOFT MAGNETIC ALLOY AND MAGNETIC DEVICE Public/Granted day:2018-08-02
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