Invention Grant
- Patent Title: Integrated circuit bridge for photonics and electrical chip integration
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Application No.: US17302853Application Date: 2021-05-13
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Publication No.: US11784175B2Publication Date: 2023-10-10
- Inventor: Matthew J. Traverso , Sandeep Razdan , Ashley J. Maker
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Patterson + Sheridan, LLP
- The original application number of the division: US15961163 2018.04.24
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L25/16 ; H01L31/02 ; H01L23/498 ; H01L21/48
Abstract:
An optoelectronic assembly and methods of fabrication thereof are provided. The assembly includes a mold compound; a photonic integrated circuit (PIC) embedded in the mold compound, that has a face exposed from the mold compound in a first plane; an interposer embedded in the mold compound, that has a face exposed from the mold compound in the first plane (i.e., co-planar with the exposed face of the PIC); and an electrical integrated circuit (EIC) coupled to the exposed face of the PIC and the exposed face of the interposer, that establishes bridging electrical connections between the PIC and the interposer.
Public/Granted literature
- US20210280568A1 INTEGRATED CIRCUIT BRIDGE FOR PHOTONICS AND ELECTRICAL CHIP INTEGRATION Public/Granted day:2021-09-09
Information query
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