Invention Grant
- Patent Title: Semiconductor integrated circuit device
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Application No.: US17838895Application Date: 2022-06-13
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Publication No.: US11784188B2Publication Date: 2023-10-10
- Inventor: Toshio Hino , Junji Iwahori
- Applicant: SOCIONEXT INC.
- Applicant Address: JP Kanagawa
- Assignee: SOCIONEXT INC.
- Current Assignee: SOCIONEXT INC.
- Current Assignee Address: JP Kanagawa
- Agency: McDermott Will & Emery LLP
- Priority: JP 16166999 2016.08.29
- Main IPC: H01L27/118
- IPC: H01L27/118 ; H01L21/8238 ; H01L29/78 ; H01L27/06 ; H01L27/02

Abstract:
The present disclosure attempts to provide a capacitor cell having a large capacitance value per unit area in a semiconductor integrated circuit device using a three-dimensional transistor device. A logic cell includes a three-dimensional transistor device. A capacitor cell includes a three-dimensional transistor device. A length of a portion, of a local interconnect, which protrudes from a three-dimensional diffusion layer in a direction away from a power supply interconnect in the capacitor cell is greater than a length of a portion, of a local interconnect, which protrudes from a three-dimensional diffusion layer in a direction away from a power supply interconnect in the logic cell.
Public/Granted literature
- US20220310658A1 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE Public/Granted day:2022-09-29
Information query
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