Invention Grant
- Patent Title: Monolithic integration of diverse device types with shared electrical isolation
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Application No.: US17407680Application Date: 2021-08-20
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Publication No.: US11784189B2Publication Date: 2023-10-10
- Inventor: Francois Hebert , Handoko Linewih
- Applicant: GLOBALFOUNDRIES U.S. Inc.
- Applicant Address: US NY Malta
- Assignee: GlobalFoundries U.S. Inc.
- Current Assignee: GlobalFoundries U.S. Inc.
- Current Assignee Address: US NY Malta
- Agency: Thompson Hine LLP
- Agent Francois Pagette
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L21/84 ; H01L27/085 ; H01L29/872

Abstract:
Structures including III-V compound semiconductor-based devices and silicon-based devices integrated on a semiconductor substrate and methods of forming such structures. The structure includes a substrate having a device layer, a handle substrate, and a buried insulator layer between the handle substrate and the device layer. The structure includes a first semiconductor layer on the device layer in a first device region, and a second semiconductor layer on the device layer in a second device region. The first semiconductor layer contains a III-V compound semiconductor material, and the second semiconductor layer contains silicon. A first device structure includes a gate structure on the first semiconductor layer, and a second device structure includes a doped region in the second semiconductor layer. The doped region and the second semiconductor layer define a p-n junction.
Public/Granted literature
- US20230059665A1 MONOLITHIC INTEGRATION OF DIVERSE DEVICE TYPES WITH SHARED ELECTRICAL ISOLATION Public/Granted day:2023-02-23
Information query
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