- 专利标题: Wireless communication apparatus and printed dual band antenna thereof
-
申请号: US17524910申请日: 2021-11-12
-
公开(公告)号: US11784411B2公开(公告)日: 2023-10-10
- 发明人: Ching-Wei Ling , Chih-Pao Lin
- 申请人: REALTEK SEMICONDUCTOR CORPORATION
- 申请人地址: TW Hsinchu
- 专利权人: REALTEK SEMICONDUCTOR CORPORATION
- 当前专利权人: REALTEK SEMICONDUCTOR CORPORATION
- 当前专利权人地址: TW Hsinchu
- 代理机构: WPAT, P.C
- 优先权: TW 9140207 2020.11.18
- 主分类号: H01Q1/38
- IPC分类号: H01Q1/38 ; H01Q5/378 ; H01Q9/04
摘要:
The present invention discloses a printed dual band antenna that includes a primary radiation portion and a parasitic radiation portion. The primary radiation portion is configured to perform signal transmitting and receiving based on a first resonant frequency and a second resonant frequency. The parasitic radiation portion is disposed on a neighboring side of the primary radiation portion, distanced from the primary radiation portion by a distance and electrically isolated from the primary radiation portion. The parasitic radiation portion couples to and resonates with the primary radiation portion to perform signal transmitting and receiving based on the second resonant frequency. The parasitic radiation portion is a grounded monopole parasitic antenna.
公开/授权文献
信息查询