Invention Grant
- Patent Title: Laser etching apparatus and laser etching method using the same
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Application No.: US16747490Application Date: 2020-01-20
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Publication No.: US11786990B2Publication Date: 2023-10-17
- Inventor: Jooseob Ahn , Taekil Oh , Gyoowan Han , Yeonghwan Ko , Yoongyeong Bae
- Applicant: Samsung Display Co., Ltd.
- Applicant Address: KR Yongin-si
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: H.C. Park & Associates, PLC
- Priority: KR 20190007581 2019.01.21
- Main IPC: B23K26/06
- IPC: B23K26/06 ; B23K26/073 ; B23K26/382 ; B23K26/082 ; B23K26/362 ; B23K103/00
Abstract:
A laser etching apparatus includes a light source to emit a first laser beam having a first energy profile; and a scanner to radiate a second laser beam upon an object along a circular path, the second laser beam having a second energy profile different from the first energy profile.
Public/Granted literature
- US20200230740A1 LASER ETCHING APPARATUS AND LASER ETCHING METHOD USING THE SAME Public/Granted day:2020-07-23
Information query
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