Invention Grant
- Patent Title: Systems and methods for automatically opening hinged components of electronic devices
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Application No.: US17057038Application Date: 2018-12-18
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Publication No.: US11789499B2Publication Date: 2023-10-17
- Inventor: Chunlin Bai , Binglin Xu , Guangrui Liang
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Fletcher Yoder, P.C.
- International Application: PCT/CN2018/121681 2018.12.18
- International Announcement: WO2020/124345A 2020.06.25
- Date entered country: 2020-11-19
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K5/02

Abstract:
The present disclosure is directed at automatically opening hinged components of computing devices. One of the computing device and a hinged component may include an electrical winding or coil while the other may include a magnet. When current is applied to the electrical winding (e.g., in a direction opposite of the North/South direction of the magnets' magnetic field), the electrical winding may generate a magnetic field opposite that repels the magnet's magnetic field. The magnetic repulsion may cause the hinged component to separate from the rest of the computing device, thereby opening the hinged component. When the current is removed from the electrical winding, the electrical winding may no longer generate a magnetic field, enabling the hinged component to be closed.
Public/Granted literature
- US20210311523A1 SYSTEMS AND METHODS FOR AUTOMATICALLY OPENING HINGED COMPONENTS OF ELECTRONIC DEVICES Public/Granted day:2021-10-07
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