An electronic device includes a heat emitting element disposed on a circuit board and a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1 degrees Celsius per Watt (° C./W).