Invention Grant
- Patent Title: Deposition of hafnium oxide within a high aspect ratio hole
-
Application No.: US17170742Application Date: 2021-02-08
-
Publication No.: US11791153B2Publication Date: 2023-10-17
- Inventor: Jiyeon Kim , Petri Raisanen , Sol Kim , Ying-Shen Kuo , Michael Schmotzer , Eric James Shero , Paul Ma
- Applicant: ASM IP HOLDING B.V.
- Applicant Address: NL Almere
- Assignee: ASM IP Holding B.V.
- Current Assignee: ASM IP Holding B.V.
- Current Assignee Address: NL Almere
- Agency: Snell & Wilmer L.L.P.
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/768

Abstract:
Methods for forming hafnium oxide within a three-dimensional structure, such as in a high aspect ratio hole, are provided. The methods may include depositing a first hafnium-containing material, such as hafnium nitride or hafnium carbide, in a three-dimensional structure and subsequently converting the first hafnium-containing material to a second hafnium-containing material comprising hafnium oxide by exposing the first hafnium-containing material to an oxygen reactant. The volume of the second hafnium-containing material may be greater than that of the first hafnium-containing material. Voids or seams formed during the deposition of the first hafnium-containing material in the three-dimensional structure may be filled by the expanded material after exposing the first hafnium-containing material to the oxygen reactant. Thus, the three-dimensional structure, such as a high aspect ratio hole, can be filled with hafnium oxide substantially free of voids or seams.
Public/Granted literature
- US20210249263A1 DEPOSITION OF HAFNIUM OXIDE WITHIN A HIGH ASPECT RATIO HOLE Public/Granted day:2021-08-12
Information query
IPC分类: