Invention Grant
- Patent Title: Universal semiconductor package molds
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Application No.: US17238151Application Date: 2021-04-22
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Publication No.: US11791170B2Publication Date: 2023-10-17
- Inventor: Anis Fauzi Bin Abdul Aziz , Chong Han Lim , Lee Han Meng@Eugene Lee , Wei Fen Sueann Lim
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Frank D. Cimino
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L21/48 ; H01L23/495 ; H01L23/31 ; B29C45/14 ; B29C33/44 ; B29C33/00
Abstract:
A method of making semiconductor packages includes providing a first lead frame having a first plurality of semiconductor dies arranged along a first longitudinal axis, each of the first plurality of semiconductor dies having a first number of metal contacts; providing a second lead frame having a second plurality of semiconductor dies arranged along a second longitudinal axis, each of the second plurality of semiconductor dies having a second number of metal contacts, the second number of metal contacts different than the first number of metal contacts; and covering the first plurality of semiconductor dies in a first mold using a common semiconductor die cavity; covering the second plurality of semiconductor dies in a second mold using the common semiconductor die cavity.
Public/Granted literature
- US20210242038A1 UNIVERSAL SEMICONDUCTOR PACKAGE MOLDS Public/Granted day:2021-08-05
Information query
IPC分类:
