- 专利标题： Package comprising passive component between substrates for improved power distribution network (PDN) performance
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申请号： US17225949申请日： 2021-04-08
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公开(公告)号： US11791276B2公开(公告)日： 2023-10-17
- 发明人: Aniket Patil , Hong Bok We , Joan Rey Villarba Buot
- 申请人： QUALCOMM Incorporated
- 申请人地址： US CA San Diego
- 专利权人： QUALCOMM INCORPORATED
- 当前专利权人： QUALCOMM INCORPORATED
- 当前专利权人地址： US CA San Diego
- 代理机构： Loza & Loza, LLP
- 主分类号： H01L23/538
- IPC分类号： H01L23/538 ; H01L21/48 ; H01L21/56 ; H01L23/31 ; H01L23/00
摘要：
A device comprising a first substrate comprising a first plurality of pillar interconnects; a second substrate comprising a second plurality of pillar interconnects, wherein the second plurality of pillar interconnects is coupled to the first plurality of pillar interconnects through a plurality of solder interconnects; a passive component located between the first substrate and the second substrate; and an integrated device coupled to the first substrate.
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