Invention Grant
- Patent Title: Bonded body of piezoelectric material substrate and supporting substrate
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Application No.: US17356864Application Date: 2021-06-24
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Publication No.: US11791796B2Publication Date: 2023-10-17
- Inventor: Takahiro Yamadera , Saki Nakayama , Yuji Hori
- Applicant: NGK INSULATORS, LTD.
- Applicant Address: JP Nagoya
- Assignee: NGK INSULATORS, LTD.
- Current Assignee: NGK INSULATORS, LTD.
- Current Assignee Address: JP Nagoya
- Agency: FLYNN THIEL, P.C.
- Priority: JP 19216528 2019.11.29
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03H9/25

Abstract:
A bonded body includes a supporting substrate; a piezoelectric material substrate composed of a material selected from the group consisting of lithium niobate, lithium tantalate and lithium niobate-lithium tantalate; and a bonding layer bonding the supporting substrate and piezoelectric material substrate and contacting a main surface of the piezoelectric material substrate. At least one of a bonding surface of the supporting substrate and a bonding surface of the piezoelectric material substrate, as measured by spectral ellipsometry with Δ being assigned to a difference of phases of p-polarized light and s-polarized light of a reflected light, has a difference of the maximum and minimum values of the difference Δ of the phases in a wavelength range of 400 nm to 760 nm of 70° or lower.
Public/Granted literature
- US20220158609A9 BONDED BODY OF PIEZOELECTRIC MATERIAL SUBSTRATE AND SUPPORTING SUBSTRATE Public/Granted day:2022-05-19
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