Invention Grant
- Patent Title: Substrate chuck for self-assembling semiconductor light emitting diodes
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Application No.: US15930853Application Date: 2020-05-13
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Publication No.: US11794310B2Publication Date: 2023-10-24
- Inventor: Inbum Yang , Imdeok Jung , Junghun Rho , Bongwoon Choi
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR 20200019248 2020.02.17
- Main IPC: H01L21/687
- IPC: H01L21/687 ; B25B5/02 ; H01L25/13

Abstract:
Discussed is a substrate chuck for self-assembling micro LEDs. The substrate chuck can include a first frame having a hole at a central portion thereof, a second frame having a hole at a central portion thereof and disposed to overlap the first frame, a frame transfer part configured to transfer the second frame so that the second frame presses the substrate while the substrate is disposed between the first and second frames, and an auxiliary clamp configured to additionally press the second frame toward the substrate while the second frame is pressing on the substrate.
Public/Granted literature
- US20210252671A1 SUBSTRATE CHUCK FOR SELF-ASSEMBLING SEMICONDUCTOR LIGHT EMITTING DIODES Public/Granted day:2021-08-19
Information query
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