公开(公告)号：US11794310B2

公开(公告)日：2023-10-24

申请号：US15930853

申请日：2020-05-13

Applicant: LG ELECTRONICS INC.

Inventor： Inbum Yang ,  Imdeok Jung ,  Junghun Rho ,  Bongwoon Choi

IPC: H01L21/687 ,  B25B5/02 ,  H01L25/13

CPC classification number: B25B5/02 ,  H01L21/68778 ,  H01L25/13

Abstract: Discussed is a substrate chuck for self-assembling micro LEDs. The substrate chuck can include a first frame having a hole at a central portion thereof, a second frame having a hole at a central portion thereof and disposed to overlap the first frame, a frame transfer part configured to transfer the second frame so that the second frame presses the substrate while the substrate is disposed between the first and second frames, and an auxiliary clamp configured to additionally press the second frame toward the substrate while the second frame is pressing on the substrate.

公开(公告)号：US11264257B2

公开(公告)日：2022-03-01

申请号：US16818296

申请日：2020-03-13

Applicant: LG ELECTRONICS INC.

Inventor： Inbum Yang ,  Junghun Rho ,  Imdeok Jung ,  Bongwoon Choi

IPC: H01L21/677 ,  H01L25/075 ,  H01L33/00

Abstract: Discussed are a device for self-assembling semiconductor light-emitting diodes, in which the device includes an assembly chamber having a space for accommodating a fluid; a magnetic field forming part having at least one magnet for applying a magnetic force to the semiconductor light-emitting diodes dispersed in the fluid and a moving part for changing positions of the at least one magnet so that the semiconductor light-emitting diodes move in the fluid; and a substrate chuck having a substrate support part configured to support a substrate, and a vertical moving part for lowering the substrate so that one surface of the substrate is in contact with the fluid in a state in which the substrate is supported by the substrate support part, wherein the vertical moving part provided at the substrate chuck lowers the substrate on to the fluid so that a force of buoyancy by the fluid is applied to the substrate.

公开(公告)号：US12002691B2

公开(公告)日：2024-06-04

申请号：US17835712

申请日：2022-06-08

Applicant: LG ELECTRONICS INC.

Inventor： Inbum Yang ,  Junghun Rho ,  Imdeok Jung ,  Bongwoon Choi

IPC: H01L21/67 ,  H01L21/683 ,  H01L25/075 ,  H01L33/32

CPC classification number: H01L21/67144 ,  H01L21/6838 ,  H01L25/0753 ,  H01L33/325

Abstract: Discussed is a device for self-assembling semiconductor light-emitting diodes for placing the semiconductor light-emitting diodes at predetermined positions on a substrate by using an electric field and a magnetic field, the substrate being accommodated in an assembly chamber accommodating a fluid, the device including a substrate chuck configured to dispose the substrate at an assembly position, wherein the substrate chuck includes a substrate support part configured to support the substrate on which an assembly electrode is formed, a rotating part configured to support the substrate support part, and a controller configured to control driving of the substrate chuck, wherein the substrate support part includes micro-holes for injecting a gas between the fluid and the substrate, and wherein the controller controls whether the gas is injected through the micro-holes according to whether the substrate is raised or lowered.

公开(公告)号：US11984337B2

公开(公告)日：2024-05-14

申请号：US17579289

申请日：2022-01-19

Applicant: LG ELECTRONICS INC.

Inventor： Inbum Yang ,  Junghun Rho ,  Imdeok Jung ,  Bongwoon Choi

IPC: H01L21/677 ,  H01L25/075 ,  H01L33/00

CPC classification number: H01L21/67709 ,  H01L21/67718 ,  H01L25/0753 ,  H01L33/0095

Abstract: Discussed is a device for self-assembling semiconductor light-emitting diodes, the device including an assembly chamber having a space for accommodating a fluid; and a substrate chuck having a substrate support part configured to support a substrate, and a vertical moving part for lowering the substrate so that one surface of the substrate is in contact with the fluid in a state in which the substrate is supported by the substrate support part.

公开(公告)号：US12272760B2

公开(公告)日：2025-04-08

申请号：US18695344

申请日：2021-10-18

Applicant: LG ELECTRONICS INC.

Inventor： Junghun Rho ,  Imdeok Jung ,  Bongwoon Choi

IPC: B23P19/00 ,  H01L21/67 ,  H01L21/68 ,  H01L23/00 ,  H01L33/00 ,  H05K13/04 ,  H01L25/075

Abstract: The assembly apparatus comprises: a main frame; a magnet head arranged on the main frame so that a semiconductor light-emitting element is self-assembled on a panel; and a vibration isolator arranged on the main frame to offset vibration of the magnet head, wherein the magnet head comprises a magnet plate assembly, which includes a magnet applying an attractive force to the semiconductor light-emitting element, and the vibration isolator comprises a weight positioned on the magnet plate assembly and may minimize the transmission, to the main frame, of vibration generated by the magnet head.

公开(公告)号：US11804384B2

公开(公告)日：2023-10-31

申请号：US16842323

申请日：2020-04-07

Applicant: LG ELECTRONICS INC.

Inventor： Inbum Yang ,  Junghun Rho ,  Imdeok Jung ,  Bongwoon Choi

IPC: H01L21/67 ,  H01L21/68 ,  H01L25/075

CPC classification number: H01L21/67011 ,  H01L21/67253 ,  H01L21/68 ,  H01L25/0753

Abstract: Discussed is a device for self-assembling semiconductor light-emitting including: a chip supply part to supply the semiconductor light-emitting diodes to the substrate in cooperation with magnets disposed in a plurality of rows to form the magnetic field, wherein the chip supply part includes: a chip accommodating part to accommodate the semiconductor light-emitting diodes; a vertical moving part to adjust a distance between the chip supply part and the magnets; a horizontal moving part to move the chip supply part such that the chip accommodating part is alternately overlapped with a part of the magnets; and a controller to drive the vertical and horizontal moving parts to control a position of the chip supply part, and the controller moves the chip supply part in at least one of a horizontal direction and a vertical direction at a predetermined path and a plurality of points existing on the predetermined path.

公开(公告)号：US12211951B2

公开(公告)日：2025-01-28

申请号：US17761839

申请日：2020-02-13

Applicant: LG ELECTRONICS INC.

Inventor： Inbum Yang ,  Junghun Rho ,  Sangsik Jung ,  Bongwoon Choi

IPC: H01L33/00 ,  H01L21/67 ,  H01L21/673

Abstract: Discussed is an assembly chamber containing a fluid. The assembly chamber includes a bottom portion, a side wall portion formed at a predetermined height on the bottom portion and disposed to surround the bottom portion, and a partition wall part formed on the bottom portion and extending from one inner surface of a plurality of inner surfaces provided in the side wall portion to another inner surface facing the one inner surface. The vertical height of at least a portion of the partition wall part is variable with respect to the bottom portion.

公开(公告)号：US11901208B2

公开(公告)日：2024-02-13

申请号：US16857818

申请日：2020-04-24

Applicant: LG ELECTRONICS INC.

Inventor： Inbum Yang ,  Imdeok Jung ,  Junghun Rho ,  Bongwoon Choi

IPC: H01L21/68 ,  H01L21/50 ,  H01L21/67 ,  H01L25/075 ,  H01L33/00 ,  H05K13/04 ,  H05K13/02 ,  H01L21/60

CPC classification number: H01L21/68 ,  H01L21/50 ,  H01L21/67126 ,  H01L21/67144 ,  H01L25/0753 ,  H01L33/0095 ,  H05K13/027 ,  H05K13/046 ,  H05K13/0478 ,  H01L2021/6009 ,  H01L2933/005 ,  H01L2933/0066

Abstract: Discussed is a substrate chuck for allowing one surface of a substrate to be in contact with a fluid, the substrate chuck including a first frame having a hole at a central portion thereof; a second frame having a hole at a central portion thereof and disposed to overlap the first frame; and a frame transfer part configured to vertically move the second frame with respect to the first frame, wherein the first frame includes: a bottom portion at which the hole is formed; and a sidewall portion formed on a peripheral edge of the bottom portion, and wherein a height of the sidewall portion is greater than a depth at which the substrate is placed into the fluid.

公开(公告)号：US11854852B2

公开(公告)日：2023-12-26

申请号：US16818222

申请日：2020-03-13

Applicant: LG ELECTRONICS INC.

Inventor： Inbum Yang ,  Junghun Rho ,  Imdeok Jung ,  Bongwoon Choi

IPC: H01L21/68 ,  H01L21/677 ,  H01L25/075 ,  H01L33/00

CPC classification number: H01L21/68 ,  H01L21/67709 ,  H01L25/0753 ,  H01L33/0095 ,  H01L2933/005

Abstract: Discussed is a substrate chuck including: a substrate support part for supporting a substrate having an assembly electrode; a vertical moving part which moves the substrate so that one surface of the substrate comes in contact with a fluid in a state in which the substrate is supported by the substrate support; an electrode connection part for applying power to the assembly electrode to generate an electric field so that semiconductor light-emitting diodes are placed at the predetermined positions of the substrate in a process of moving the semiconductor light-emitting diodes by a position change of at least one magnet; and a rotating part for rotating the substrate support part around a rotating shaft so that the substrate is placed in an upward or downward direction, wherein the rotating shaft is spaced apart from a center of the substrate support part at a predetermined distance.

公开(公告)号：US11410864B2

公开(公告)日：2022-08-09

申请号：US16842347

申请日：2020-04-07

Applicant: LG ELECTRONICS INC.

Inventor： Inbum Yang ,  Junghun Rho ,  Imdeok Jung ,  Bongwoon Choi

IPC: H01L21/67 ,  H01L21/683 ,  H01L25/075 ,  H01L33/32

Abstract: Discussed is a device for self-assembling semiconductor light-emitting diodes includes a substrate chuck that is provided in an assembly chamber and supports a substrate and disposes the substrate at an assembly position, wherein the substrate chuck sucks or injects a gas present between the substrate and a fluid during loading and unloading of the substrate.