Invention Grant
- Patent Title: Composite material structure
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Application No.: US17722406Application Date: 2022-04-18
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Publication No.: US11794447B2Publication Date: 2023-10-24
- Inventor: Han-Ching Huang , Jung-Chin Wu , Kuo-Nan Ling , Sheng-Hung Lee
- Applicant: Han-Ching Huang , Jung-Chin Wu , Kuo-Nan Ling , Sheng-Hung Lee
- Applicant Address: TW Taipei
- Assignee: COMPAL ELECTRONICS, INC.
- Current Assignee: COMPAL ELECTRONICS, INC.
- Current Assignee Address: TW Taipei
- Agency: JCIPRNET
- Main IPC: B32B27/08
- IPC: B32B27/08 ; B32B7/022

Abstract:
A composite material structure includes a first fiber layer, a second fiber layer, and a third fiber layer. The first fiber layer is composed of a first long fiber and a first resin material. The second fiber layer is composed of a second long fiber and a second resin material. The third fiber layer is disposed between the first fiber layer and the second fiber layer. The third fiber layer is composed of a short fiber and a third resin material. A length of the first long fiber and a length of the second long fiber are both greater than a length of the short fiber, and the length of the short fiber is less than or equal to 25 mm.
Public/Granted literature
- US20220332087A1 COMPOSITE MATERIAL STRUCTURE Public/Granted day:2022-10-20
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