Abstract:
A manufacturing process for vacuum heat transfer printing is used for transfer printing a pattern of a film onto a main surface of a workpiece. The manufacturing process for vacuum heat transfer printing includes: disposing the workpiece and the film in a mold cavity, wherein the film is located above the main surface of the workpiece, and the main surface is divided into a plurality of blocks; heating the mold cavity; and providing different negative pressures into the mold cavity corresponding to each of the blocks, such that the film is vacuumed onto the blocks in sequence and the patterns are transfer printed onto the main surface of the workpiece in sequence. A jig for the manufacturing process for vacuum heat transfer printing is also provided.
Abstract:
A shell structure suitable for an electronic device is provided. The electronic device has a heat generating element. The shell structure includes a core layer, a first material layer, and a second material layer. The core layer includes a thermal insulating area and a thermal conducting area. The core layer has first and second surfaces opposite to each other. The first material layer is configured on the first surface. The second material layer is configured on the second surface. The thermal insulating area is aligned to the heat generating element, and the shell structure covers the heat generating element, such that heat generated by the heat generating element is transferred to the first material layer through the second material layer and the heat conducting area to perform heat dissipation, and a position of the first material layer aligned to the heat generating element is prevented from generating a heat point.
Abstract:
A shell structure includes a composite material layer and a second material layer is provided. The composite material layer includes a woven layer and a first material layer. The woven layer has a first surface and a second surface opposite to each other. The first material layer is located on the first surface and has a plurality of through-holes. The second material layer is disposed on the first material layer and has a plurality of extending-portions adapted to be combined with the woven layer and fix the second material layer and the composite material layer to each other. In addition, a manufacturing method for shell structure of electronic device is also provided.
Abstract:
A three-dimensional workpiece including a first ductile plate, a second ductile plate and a core layer is provided. The core layer is located between the first ductile plate and the second ductile plate. The first ductile plate, the second ductile plate and the core layer are bound together and have a three-dimensional shape. The first ductile plate has a flat area and a curved area. The core layer has a core flat area and a core curved area. The core flat area is superposed with the plate flat area and the core curved area is superposed with the plate curved area.
Abstract:
An electronic device including a first housing, a second housing and a pivot structure is provided. The pivot structure includes a pivot shaft, a sliding component and a supporting component. The pivot shaft is pivoted on the first housing. The sliding component is disposed on the second housing. One end of the sliding component sleeves the pivot shaft, such that the second housing rotates relative to the first housing. The supporting component has a first end and a second end. The first end is pivoted to the first housing. When the second housing rotates relative to the first housing, the supporting component provides a supporting force to the second housing.
Abstract:
A shell structure includes a composite material layer and a second material layer is provided. The composite material layer includes a woven layer and a first material layer. The woven layer has a first surface and a second surface opposite to each other. The first material layer is located on the first surface and has a plurality of through-holes. The second material layer is disposed on the first material layer and has a plurality of extending-portions adapted to be combined with the woven layer and fix the second material layer and the composite material layer to each other. In addition, a manufacturing method for shell structure of electronic device is also provided.
Abstract:
A display module including an electronic component and a panel module is provided. The electronic component is installed inside the display module. The panel module includes a first side and a second side, and the first side includes a glass module having an electro-conductive material and a display region, wherein the glass module includes an electronic component projection area and the electronic component projection area does not contain the electro-conductive material to prevent affecting the performance of the electronic component. The electronic component projection area is an area where the electronic component is projected on the panel module along a normal direction of the display region. According to a design requirement of the product, the electronic component may be fixed to a frame combined with the panel module or located in the glass module.
Abstract:
A display module includes a panel module and a frame and is able to be assembled to a cover to form a display device. A first fixing portion on a sidewall of the cover is snapped to a second fixing portion of the frame, such that the cover is fixed on the display module to form the display device. The panel module includes a first and a second sides, wherein the first side has a display region, and the panel module is adhered to the frame by the second side, such that the frame is the only structure substantially providing support to the panel module. When the display module has a backlight source, the panel module includes a glass module and a back light module. When the display module has no backlight source, the panel module only includes a glass module.
Abstract:
A display module includes a panel module and a frame and is able to be assembled to a cover to form a display device. At first, the panel module is provided that includes the first side and the second side and then a frame is provided, where the frame has an opening. Then, the second side of the panel module is adhered to the frame and covers the opening to form the display module, where the frame is the only structure substantially providing support to the panel module and the first side of the panel module includes a display region. Finally, a cover is fixed to the frame to form the display device, where a sidewall of the cover is snapped to the frame. The cover and the frame provide support to the panel module to strengthen a structural strength of the display module.
Abstract:
An electronic device includes a housing, a touch module and a switch module. The housing has an opening and a supporting plate, wherein one side of the supporting plate is connected to the housing. The touch module is disposed over the supporting plate and one side connected to the housing. The switch module is disposed under the supporting plate and corresponding to a side of the touch module, wherein the side of the touch module is bent to turn on the switch module when a force is applied to the side of the touch module.