- 专利标题: Resin composition, resin molded body, and article
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申请号: US17703799申请日: 2022-03-24
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公开(公告)号: US11795294B2公开(公告)日: 2023-10-24
- 发明人: Kento Tsuda , Akira Yane
- 申请人: CANON KABUSHIKI KAISHA
- 申请人地址: JP Tokyo
- 专利权人: Canon Kabushiki Kaisha
- 当前专利权人: Canon Kabushiki Kaisha
- 当前专利权人地址: JP Tokyo
- 代理机构: Canon U.S.A., Inc., IP Division
- 优先权: JP 21054919 2021.03.29
- 主分类号: C08K3/22
- IPC分类号: C08K3/22 ; C08K3/26 ; C08L77/00
摘要:
A resin composition containing a resin, a magnetic powder, a first non-magnetic powder with a water-soluble content in the range of 0.1% to 0.5%, and a second non-magnetic powder with a water-soluble content of 0.05% or less.
公开/授权文献
- US20220315734A1 RESIN COMPOSITION, RESIN MOLDED BODY, AND ARTICLE 公开/授权日:2022-10-06
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