Invention Grant
- Patent Title: Method for manufacturing probes for testing integrated electronic circuits
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Application No.: US17496154Application Date: 2021-10-07
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Publication No.: US11796568B2Publication Date: 2023-10-24
- Inventor: Alberto Pagani
- Applicant: STMicroelectronics S.r.l.
- Applicant Address: IT Agrate Brianza
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza
- Agency: CROWE & DUNLEVY
- Priority: IT 2010A000844 2010.05.12
- The original application number of the division: US16130536 2018.09.13
- Main IPC: H05K3/30
- IPC: H05K3/30 ; G01R3/00 ; G01R31/319 ; G01R1/067 ; G01R1/073

Abstract:
Cantilever probes are produced for use in a test apparatus of integrated electronic circuits. The probes are configured to contact corresponding terminals of the electronic circuits to be tested during a test operation. The probe bodies are formed of electrically conductive materials. On a lower portion of each probe body that, in use, is directed to the respective terminal to be contacted, an electrically conductive contact region is formed having a first hardness value equal to or greater than 300 HV; each contact region and the respective probe body form the corresponding probe.
Public/Granted literature
- US20220026466A1 PROBES FOR TESTING INTEGRATED ELECTRONIC CIRCUITS AND CORRESPONDING PRODUCTION METHOD Public/Granted day:2022-01-27
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