Invention Grant
- Patent Title: Multilayer electronic component
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Application No.: US17971914Application Date: 2022-10-24
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Publication No.: US11798747B2Publication Date: 2023-10-24
- Inventor: Jae Seok Yi , Il Ro Lee , Chang Hak Choi , Bon Seok Koo , Jung Min Kim , Byung Woo Kang , San Kyeong
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20190169536 2019.12.18
- Main IPC: H01G2/06
- IPC: H01G2/06 ; H01G4/008 ; H01G4/012 ; H01G4/12 ; H01G4/30

Abstract:
A multilayer electronic component include a first non-conductive resin layer, extending between a conductive resin layer and an electrode layer of a first external electrode, and a second non-conductive resin layer extending between a conductive resin layer and an electrode layer of a second external electrode. The first non-conductive layer and the second non-conductive layer may be spaced apart from each other to suppress arc discharge and to improve bending strength.
Public/Granted literature
- US20230066593A1 MULTILAYER ELECTRONIC COMPONENT Public/Granted day:2023-03-02
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