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公开(公告)号：US20240371570A1
公开(公告)日：2024-11-07
申请号：US18774662
申请日：2024-07-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Byung Woo Kang , Bon Seok Koo , Jeong Ryeol Kim , Jung Min Kim , Jae Seok Yi , Ji Hye Han , Hye Jin Park
Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction and including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in the first direction, and external electrodes disposed on the third and fourth surfaces, wherein the external electrodes include an electrode layer disposed on the body and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a conductive metal, an epoxy resin, and an acrylic resin.
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公开(公告)号：US12068110B2
公开(公告)日：2024-08-20
申请号：US18198419
申请日：2023-05-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Byung Woo Kang , Bon Seok Koo , Jeong Ryeol Kim , Jung Min Kim , Jae Seok Yi , Ji Hye Han , Hye Jin Park
Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction and including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in the first direction, and external electrodes disposed on the third and fourth surfaces, wherein the external electrodes include an electrode layer disposed on the body and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a conductive metal, an epoxy resin, and an acrylic resin.
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公开(公告)号：US12009154B2
公开(公告)日：2024-06-11
申请号：US17682023
申请日：2022-02-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ji Hye Han , Jung Min Kim , Byung Woo Kang , Hong Je Choi , Hye Jin Park , Sang Wook Lee , Bon Seok Koo , Jung Won Lee
CPC classification number: H01G4/2325 , H01G4/30
Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, an intermetallic compound layer disposed on the electrode layer and including a first intermetallic compound and glass, and a conductive resin layer disposed on the intermetallic compound layer and including a conductive connection portion including a second intermetallic compound and a low-melting-point metal, a plurality of metal particles, and a resin. A ratio of a length of a first direction component of a region having the first intermetallic compound, with respect to a length of a first direction component of the intermetallic compound layer, is 20% or more.
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公开(公告)号：US20230402229A1
公开(公告)日：2023-12-14
申请号：US18239911
申请日：2023-08-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： San Kyeong , Chang Hak Choi , Jae Seok Yi , Bon Seok Koo , Jung Min Kim , Hae Sol Kang , Jun Hyeon Kim
CPC classification number: H01G4/30 , H01G4/012 , H01G2/065 , H01G4/008 , H01G4/1218
Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.
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公开(公告)号：US11804332B2
公开(公告)日：2023-10-31
申请号：US17665462
申请日：2022-02-04
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hye Jin Park , Bon Seok Koo , Jung Min Kim , Hong Je Choi , Byung Woo Kang , Ji Hye Han , Sang Wook Lee
Abstract: A multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes stacked on each other interposing the dielectric layer therebetween, and external electrodes respectively disposed on the body, wherein the external electrode includes: a first electrode layer connected to the internal electrode; and a second electrode layer disposed on the first electrode layer, and including a conductive portion including an silver (Ag)-tin (Sn) alloy and a resin, and a ratio of an area of the Ag—Sn alloy to an area of the conductive portion satisfies 3 to 50% in at least a portion of a cross-section of the second electrode layer.
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Patent Agency Ranking
公开(公告)号：US11804327B2
公开(公告)日：2023-10-31
申请号：US17552855
申请日：2021-12-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yoon Hee Lee , Bon Seok Koo , Yeon Tae Kim , Chang Hak Choi , Jung Min Kim
CPC classification number: H01F27/2804 , H01F17/0013 , H01F27/292 , H01F27/323 , H01F41/041 , H01F41/122 , H01F2027/2809
Abstract: A coil component includes: a body including a magnetic material and a coil of which both ends are externally exposed; intermetallic compounds disposed on the exposed both ends of the coil; and external electrodes disposed on the body to cover the intermetallic compounds. The external electrodes include: conductive resin layers disposed on outer surfaces of the body to contact the exposed both ends of the coil and including base resins, a plurality of metal particles disposed in the base resins, and conductive connecting parts surrounding the plurality of metal particles and contacting the intermetallic compounds. The coil component further includes electrode layers disposed on the conductive resin layers and contacting the conductive connecting parts.
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公开(公告)号：US11784005B2
公开(公告)日：2023-10-10
申请号：US17836383
申请日：2022-06-09
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： San Kyeong , Chang Hak Choi , Jae Seok Yi , Bon Seok Koo , Jung Min Kim , Hae Sol Kang , Jun Hyeon Kim
CPC classification number: H01G4/30 , H01G2/065 , H01G4/008 , H01G4/012 , H01G4/1218
Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.
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公开(公告)号：US11735364B2
公开(公告)日：2023-08-22
申请号：US17512084
申请日：2021-10-27
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jun Hyeon Kim , Hae Sol Kang , Bon Seok Koo , San Kyeong , Chang Hak Choi , Jung Min Kim
CPC classification number: H01G4/2325 , H01G4/1218 , H01G4/30 , H01G4/306
Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a metal wire, a conductive metal, and a base resin.
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公开(公告)号：US11694844B2
公开(公告)日：2023-07-04
申请号：US17308273
申请日：2021-05-05
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Byung Woo Kang , Bon Seok Koo , Jeong Ryeol Kim , Jung Min Kim , Jae Seok Yi , Ji Hye Han , Hye Jin Park
Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction and including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in the first direction, and external electrodes disposed on the third and fourth surfaces, wherein the external electrodes include an electrode layer disposed on the body and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a conductive metal, an epoxy resin, and an acrylic resin.
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公开(公告)号：US11189424B2
公开(公告)日：2021-11-30
申请号：US16836342
申请日：2020-03-31
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jun Hyeon Kim , Hae Sol Kang , Bon Seok Koo , San Kyeong , Chang Hak Choi , Jung Min Kim
Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a metal wire, a conductive metal, and a base resin.
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