- Patent Title: Electronic device and method of fabricating an electronic device
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Application No.: US17486868Application Date: 2021-09-27
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Publication No.: US11798880B2Publication Date: 2023-10-24
- Inventor: Hirofumi Watsuda , Shu-Ming Kuo , Chun-Hsien Lin
- Applicant: Innolux Corporation
- Applicant Address: TW Miao-Li County
- Assignee: Innolux Corporation
- Current Assignee: Innolux Corporation
- Current Assignee Address: TW Miaoli County
- Agency: JCIPRNET
- Main IPC: H01L23/525
- IPC: H01L23/525 ; H01L21/768 ; H01L33/62

Abstract:
An electronic device and method of fabricating the same are provided herein. The electronic device includes a first main pad; a second main pad; a first repair line electrically connected to the first main pad; a second repair line electrically connected to the second main pad, wherein the first repair line and the second repair line forms a first weldable region; a first spare pad; a second spare pad; a connection line electrically connected to the second repair line, the first spare pad and the second spare pad; and a first electronic unit disposed on the first main pad and the second main pad.
Public/Granted literature
- US20230102061A1 ELECTRONIC DEVICE AND METHOD OF FABRICATING AN ELECTRONIC DEVICE Public/Granted day:2023-03-30
Information query
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