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    FLEXIBLE ELECTRONIC DEVICE
    2.
    发明公开
    FLEXIBLE ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20240363649A1

    公开(公告)日：2024-10-31

    申请号：US18769713

    申请日：2024-07-11

    申请人： InnoLux Corporation

    发明人： Ti-Chung CHANG ,  Chih-Chieh WANG ,  Chien-Chih CHEN

    IPC分类号： H01L27/12 ,  H01L23/498 ,  H10K77/10 ,  H10K102/00

    CPC分类号： H01L27/1244 ,  H01L23/4985 ,  H01L27/1218 ,  H01L27/1262 ,  H10K77/111 ,  H10K2102/311

    摘要： An electronic device having a first area and a second area adjacent to the first area is provided, which includes a flexible substrate, a first conductive layer disposed on the flexible substrate and in the first area and the second area, a semiconductor disposed on the flexible substrate and electrically connected to the first conductive layer, a second conductive layer disposed on the first conductive layer, and an organic layer disposed on the first conductive layer and in the first area and the second area. The second conductive layer has a first portion and a second portion are respectively contacted the first conductive layer in the first area. In a cross-sectional view, a first portion of the organic layer is directly contacted the first conductive layer and the second conductive layer and disposed between the first portion and the second portion of the second conductive layer.

    HEAD MOUNTED ELECTRONIC DEVICE
    5.
    发明公开
    HEAD MOUNTED ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20240345305A1

    公开(公告)日：2024-10-17

    申请号：US18597944

    申请日：2024-03-07

    申请人： Innolux Corporation

    发明人： Jian-Min Leu ,  Chih-Lung Lin ,  Yung-Hsin Lu

    IPC分类号： G02B5/30

    CPC分类号： G02B5/3083

    摘要： A head mounted electronic device includes a dimming module. The dimming module has a normal direction. The dimming module has a first transmittance T1 in the normal direction and a second transmittance T2 in an oblique direction. An included angle between the oblique direction and the normal direction is 60 degrees. The head mounted electronic device satisfies: [(T1-T2)/T1]*100%

    ELECTRONIC DEVICE
    7.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20240339392A1

    公开(公告)日：2024-10-10

    申请号：US18599624

    申请日：2024-03-08

    申请人： InnoLux Corporation

    发明人： Chih-Hao CHANG ,  Te-Hsun LIN ,  Wen-Hsiang LIAO

    IPC分类号： H01L23/498 ,  H01L23/00

    CPC分类号： H01L23/49838 ,  H01L23/49827 ,  H01L24/20 ,  H01L24/16 ,  H01L24/19 ,  H01L2224/16227 ,  H01L2224/19 ,  H01L2224/211

    摘要： An electronic device includes a circuit structure including: a first insulation layer including a first opening; a second insulation layer disposed in the first opening and including a second opening; a conductive connection layer disposed in the second opening; and a first conductive layer and a second conductive layer respectively disposed on a surface and another surface of the first insulation layer. The first and the second conductive layer are electrically connected through the conductive connection layer, and the Young's modulus of the second insulation layer is less than the Young's modulus of the first insulation layer. In a cross-section of the electronic device, a center of the second opening and an outer surface of the second insulation layer are separated by a first distance X1, and a maximum width W of the second opening and the first distance X1 conform to the following formula:






    1
    .
    5

    ⁢
    W

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    X
    1

    ELECTRONIC DEVICE
    8.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20240338061A1

    公开(公告)日：2024-10-10

    申请号：US18746044

    申请日：2024-06-18

    申请人： Innolux Corporation

    发明人： Ming-Jou Tai ,  Chia-Hao Tsai

    IPC分类号： G06F1/18 ,  H01L27/12

    CPC分类号： G06F1/189 ,  H01L27/124

    摘要： An electronic device includes a substrate, a first signal line, an insulating layer, a first transparent conductive layer and a metal layer. The first signal line is disposed on the substrate. The insulating layer is disposed on the first signal line and has an opening. The first transparent conductive layer is disposed on the insulating layer. The metal layer is disposed between the insulating layer and the first transparent conductive layer. The metal layer is electrically connected to the first transparent conductive layer. At least a portion of the metal layer and at least a portion of the first transparent conductive layer are disposed in the opening.