Invention Grant
- Patent Title: Gate-all-around integrated circuit structures having adjacent structures for sub-fin electrical contact
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Application No.: US16716907Application Date: 2019-12-17
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Publication No.: US11799009B2Publication Date: 2023-10-24
- Inventor: Biswajeet Guha , William Hsu , Chung-Hsun Lin , Kinyip Phoa , Oleg Golonzka , Tahir Ghani
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe Williamson & Wyatt P.C.
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L27/088 ; H01L29/786 ; H01L29/417

Abstract:
Gate-all-around integrated circuit structures having adjacent structures for sub-fin electrical contact are described. For example, an integrated circuit structure includes a semiconductor island on a semiconductor substrate. A vertical arrangement of horizontal nanowires is above a fin protruding from the semiconductor substrate. A channel region of the vertical arrangement of horizontal nanowires is electrically isolated from the fin. The fin is electrically coupled to the semiconductor island. A gate stack is over the vertical arrangement of horizontal nanowires.
Public/Granted literature
- US20210184014A1 GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ADJACENT STRUCTURES FOR SUB-FIN ELECTRICAL CONTACT Public/Granted day:2021-06-17
Information query
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