Invention Grant
- Patent Title: Gate isolation feature and manufacturing method thereof
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Application No.: US17091767Application Date: 2020-11-06
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Publication No.: US11799019B2Publication Date: 2023-10-24
- Inventor: Kuan-Ting Pan , Huan-Chieh Su , Jia-Chuan You , Shi Ning Ju , Kuo-Cheng Chiang , Yi-Ruei Jhan , Li-Yang Chuang , Chih-Hao Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: HAYNES AND BOONE, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/8234 ; H01L29/06

Abstract:
A semiconductor structure includes a plurality of fin structures extending along a first direction, a plurality of gate structure segments positioned along a line extending in a second direction, the second direction being orthogonal to the first direction, wherein the gate structure segments are separated by dummy fin structures. The semiconductor structure further includes a conductive layer disposed over both the gate structure segments and the dummy fin structures to electrically connect at least some of the gate structure segments, and a cut feature aligned with one of the dummy fin structures and positioned to electrically isolate gate structure segments on both sides of the one of the dummy fin structures.
Public/Granted literature
- US20210273075A1 Gate Isolation Feature and Manufacturing Method Thereof Public/Granted day:2021-09-02
Information query
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