Invention Grant
- Patent Title: Transducer system with configurable acoustic overload point
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Application No.: US17747454Application Date: 2022-05-18
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Publication No.: US11800299B2Publication Date: 2023-10-24
- Inventor: Robert Littrell , Ronald Gagnon
- Applicant: Qualcomm Technologies Inc.
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Technologies, Inc.
- Current Assignee: QUALCOMM Technologies, Inc.
- Current Assignee Address: US CA San Diego
- Agency: QUALCOMM Technologies, Inc.
- The original application number of the division: US16353589 2019.03.14
- Main IPC: H04R3/00
- IPC: H04R3/00 ; H04R19/04 ; H04R17/02 ; H04R1/04 ; H04R19/00

Abstract:
A MEMS transducer system has a transducer configured to convert a received signal into an output signal for forwarding by a transducer output port, and an integrated circuit having an IC input in communication with the transducer output port. The IC input is configured to receive an IC input signal produced as a function of the output signal. The system also has a dividing element coupled between the IC input and the transducer output port. The dividing element is configured to selectively attenuate one or more signals into the IC input to at least in part produce the IC input signal. Other implementations may couple a feedback loop to the ground of the transducer (similar to bootstrapping), or pick off voltages at specific portions of the transducer.
Public/Granted literature
- US20220279286A1 TRANSDUCER SYSTEM WITH CONFIGURABLE ACOUSTIC OVERLOAD POINT Public/Granted day:2022-09-01
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