The disclosure provides a micro control device for simulating the electric thermal field change of a plate/strip, comprising a plate shape simulating test platform, a high current regulating power supply, a current regulating device, a thermal imager, a thermocouple, a non-contact type full field strain gauge, a high-power current control device and an electro-plastic control system; for a plate/strip with large width to thickness ratio and high hardness and brittleness alloy, different numbers of electrodes are arranged laterally along the movable supporting beam. A high-power current control device is used to realize the sub-regional control of the electric field, thermal field and stress field of the plate/strip; at the same time, the movable supporting beam and tension sensor are used to test the working conditions of the plate/strips with different lengths and widths, to simulate the instantaneous synchronous entanglement process between different fields. An electro-plastic control system is used to realize the intelligent closed-loop control of specific working conditions. The device provides a high-precision physical test platform for studying the non-uniform electro-plastic effect of a high width to thickness ratio and high hardness brittle strip during an actual rolling process, and adds a new and high-efficiency adjustment method to the traditional rolling mill system.