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公开(公告)号：US11705019B2
公开(公告)日：2023-07-18
申请号：US17143245
申请日：2021-01-07
申请人： Yanshan University
发明人： Lipo Yang , Shuguang Liu , Jiaxuan Yang , Yunpeng Liu , Gengliang Liu , Hailong Zhang
CPC分类号： G09B23/16 , B21B37/74 , B21B45/004 , G01K3/00 , G09B25/02
摘要： The present invention provides a dynamic contact heat transfer simulation device for rolling heavy-load deformation zone. The device includes a control system, a data acquisition system, a pressure-adjustable fixed cold end, a rotating chuck, a temperature-adjustable heat-conducting rod and an speed-adjustable rotation hot end; the device utilizes the rotating chuck and the speed-adjustable rotating hot end to adjust the rotation speed in real time according to the actual rolling conditions, simulate the working conditions of the actual rolling heavy-load deformation zone, and accurately obtain the dynamic heat transfer coefficient of the rotating contact interface under variable load pressure conditions.
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公开(公告)号：US20210220884A1
公开(公告)日：2021-07-22
申请号：US17143245
申请日：2021-01-07
申请人： Yanshan University
发明人： Lipo Yang , Shuguang Liu , Jiaxuan Yang , Yunpeng Liu , Gengliang Liu , Hailong Zhang
摘要： The present invention provides a dynamic contact heat transfer simulation device for rolling heavy-load deformation zone. The device includes a control system, a data acquisition system, a pressure-adjustable fixed cold end, a rotating chuck, a temperature-adjustable heat-conducting rod and an speed-adjustable rotation hot end; the device utilizes the rotating chuck and the speed-adjustable rotating hot end to adjust the rotation speed in real time according to the actual rolling conditions, simulate the working conditions of the actual rolling heavy-load deformation zone, and accurately obtain the dynamic heat transfer coefficient of the rotating contact interface under variable load pressure conditions.
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公开(公告)号：US11801542B2
公开(公告)日：2023-10-31
申请号：US17209320
申请日：2021-03-23
申请人： Yanshan University
发明人： Lipo Yang , Gengliang Liu , Hailong Zhang , Jiaxuan Yang , Lei Pan , Yunpeng Liu
CPC分类号： B21B37/74 , C21D1/40 , C21D9/52 , C21D11/00 , B21B2261/21 , B21B2263/02
摘要： The disclosure provides a micro control device for simulating the electric thermal field change of a plate/strip, comprising a plate shape simulating test platform, a high current regulating power supply, a current regulating device, a thermal imager, a thermocouple, a non-contact type full field strain gauge, a high-power current control device and an electro-plastic control system; for a plate/strip with large width to thickness ratio and high hardness and brittleness alloy, different numbers of electrodes are arranged laterally along the movable supporting beam. A high-power current control device is used to realize the sub-regional control of the electric field, thermal field and stress field of the plate/strip; at the same time, the movable supporting beam and tension sensor are used to test the working conditions of the plate/strips with different lengths and widths, to simulate the instantaneous synchronous entanglement process between different fields. An electro-plastic control system is used to realize the intelligent closed-loop control of specific working conditions. The device provides a high-precision physical test platform for studying the non-uniform electro-plastic effect of a high width to thickness ratio and high hardness brittle strip during an actual rolling process, and adds a new and high-efficiency adjustment method to the traditional rolling mill system.
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