- Patent Title: Lead-free glass paste, chip resistor and method for producing same
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Application No.: US17487666Application Date: 2021-09-28
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Publication No.: US11802076B2Publication Date: 2023-10-31
- Inventor: Hongkun Shen
- Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Applicant Address: CN Hefei
- Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee Address: CN Hefei
- Agency: Cooper Legal Group, LLC
- Priority: CN 2010710018.6 2020.07.22
- Main IPC: C03C8/16
- IPC: C03C8/16 ; C03C8/02 ; H01C1/14 ; H01C1/01 ; H01C17/28 ; H01C7/00 ; H01C17/065 ; H01C17/00
Abstract:
A lead-free glass paste, a chip resistor and a method for producing the same are provided. The lead-free glass paste includes 6-7 parts by mass of borosilicate oil, 12-21 parts by mass of aluminum oxide powder, 2-3 parts by mass of glass fiber powder, and 0.1-0.5 parts by mass of a curing agent.
Public/Granted literature
- US20220024808A1 LEAD-FREE GLASS PASTE, CHIP RESISTOR AND METHOD FOR PRODUCING SAME Public/Granted day:2022-01-27
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