Invention Grant
- Patent Title: Solvent-based adhesive compositions
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Application No.: US16620805Application Date: 2018-04-24
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Publication No.: US11802227B2Publication Date: 2023-10-31
- Inventor: Wenwen Li , Joseph J. Zupancic , William J. Harris , Paul G. Clark , Thorsten Schmidt
- Applicant: Dow Global Technologies LLC , Rohm and Haas Company
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC,Rohm and Haas Company
- Current Assignee: Dow Global Technologies LLC,Rohm and Haas Company
- Current Assignee Address: US MI Midland; US PA Collegeville
- Agency: Boyle Fredrickson, S.C.
- International Application: PCT/US2018/028993 2018.04.24
- International Announcement: WO2018/226320A 2018.12.13
- Date entered country: 2019-12-09
- Main IPC: C09J175/06
- IPC: C09J175/06 ; B32B7/12 ; B32B15/085 ; B32B15/09 ; B32B15/095 ; B32B27/32 ; B32B27/36 ; B32B27/38 ; B32B27/08 ; B32B27/40 ; C08L75/06 ; C08G18/32 ; C08G18/58 ; C08G63/16 ; C08G63/91 ; C08K3/32 ; C08K5/06

Abstract:
Solvent-based adhesive composition are disclosed, the compositions comprising (A) a polyester-urethane resin, (B) an epoxy-terminated polyester compound, (C) a phosphoric acid, and (D) an aliphatic isocyanate curing agent. Methods for preparing a solvent-based adhesive composition, the methods comprising providing a polyester-urethane resin, providing an epoxy-terminated polyester compound, mixing the polyester-urethane resin, epoxy-terminated polyester compound, and phosphoric acid to form a resin mixture, diluting the resin mixture in a solvent to form a diluted resin mixture having an application solid content from 25 to 55 weight percent, based on the total weight of the diluted resin mixture, and curing the diluted resin mixture with an aliphatic isocyanate curing agent at a mix ratio (parts by weight resin mixture before dilution:parts by weight aliphatic isocyanate curing agent) of from 100:1 to 100:12. Laminates prepared comprising the solvent-based adhesives and according to the disclosed methods are also disclosed.
Information query
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