Invention Grant
- Patent Title: Coil component and method of manufacturing the same
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Application No.: US17552855Application Date: 2021-12-16
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Publication No.: US11804327B2Publication Date: 2023-10-31
- Inventor: Yoon Hee Lee , Bon Seok Koo , Yeon Tae Kim , Chang Hak Choi , Jung Min Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: MORGAN, LEWIS & BOCKIUS LLP
- Priority: KR 20160094705 2016.07.26 KR 20160152722 2016.11.16 KR 20160176097 2016.12.21
- The original application number of the division: US15472700 2017.03.29
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F17/00 ; H01F27/29 ; H01F27/32 ; H01F41/04 ; H01F41/12

Abstract:
A coil component includes: a body including a magnetic material and a coil of which both ends are externally exposed; intermetallic compounds disposed on the exposed both ends of the coil; and external electrodes disposed on the body to cover the intermetallic compounds. The external electrodes include: conductive resin layers disposed on outer surfaces of the body to contact the exposed both ends of the coil and including base resins, a plurality of metal particles disposed in the base resins, and conductive connecting parts surrounding the plurality of metal particles and contacting the intermetallic compounds. The coil component further includes electrode layers disposed on the conductive resin layers and contacting the conductive connecting parts.
Public/Granted literature
- US20220108828A1 COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2022-04-07
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