Invention Grant
- Patent Title: Method of monitoring tool
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Application No.: US17568611Application Date: 2022-01-04
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Publication No.: US11804392B2Publication Date: 2023-10-31
- Inventor: Hom-Chung Lin , Chi-Ying Chang , Jih-Churng Twu , Chin-Yun Chen , Yi-Ting Chang , Feng-Yu Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677
Abstract:
A method includes transferring a tool monitoring device to a load port of a tool. An environmental parameter of the load port is monitored by the tool monitoring device. The tool monitoring device is removed from the load port after the environmental parameter of the load port is monitored. A door of the tool in front of the load port is closed. The door of the tool is kept closed during a period from a time of transferring the tool monitoring device to the load port to a time of removing the tool monitoring device from the load port.
Public/Granted literature
- US20220130697A1 METHOD OF MONITORING TOOL Public/Granted day:2022-04-28
Information query
IPC分类:
