Invention Grant
- Patent Title: Mixed pad size and pad design
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Application No.: US17097327Application Date: 2020-11-13
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Publication No.: US11804428B2Publication Date: 2023-10-31
- Inventor: Wen Yin , Yonghao An , Manuel Aldrete
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM INCORPORATED
- Current Assignee: QUALCOMM INCORPORATED
- Current Assignee Address: US CA San Diego
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/498
Abstract:
Disclosed is a package and method of forming the package with a mixed pad size. The package includes a first set of pads having a first size and a first pitch, where the first set of pads are solder mask defined (SMD) pads. The package also includes a second set of pads having a second size and a second pitch, where the second set of pads are non-solder mask defined (NSMD) pads.
Public/Granted literature
- US20220157705A1 MIXED PAD SIZE AND PAD DESIGN Public/Granted day:2022-05-19
Information query
IPC分类:
