Invention Grant
- Patent Title: Semiconductor package including heat dissipation structure
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Application No.: US17008961Application Date: 2020-09-01
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Publication No.: US11804444B2Publication Date: 2023-10-31
- Inventor: Yongjin Park , Myungsam Kang , Youngchan Ko , Seonho Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Fish & Richardson P.C.
- Priority: KR 20200010033 2020.01.28
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/373 ; H01L23/498 ; H01L21/48

Abstract:
A semiconductor package includes; a semiconductor chip including a top surface and an opposing bottom surface, a heat dissipation structure including a lower adhesive layer adhered to the top surface of the semiconductor chip, a heat dissipation layer disposed on the lower adhesive layer, and a conductive layer disposed on the heat dissipation layer, a core layer including a cavity and a lower surface, wherein a combination of the semiconductor chip and the heat dissipation structure is disposed within the cavity, and a bottom re-wiring layer including a bottom re-wiring line connected to the semiconductor chip.
Public/Granted literature
- US20210233826A1 SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE Public/Granted day:2021-07-29
Information query
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